Semiconductor wafer cutting processing

We can process and thin semiconductor wafers, LEDs, glass, ceramics, sapphire and other products.

The size of the square wafer is 1mm to 210mm, with high accuracy, no dust particles are contaminated, and does not affect the performance and use of the silicon wafer itself.
According to different products, blade or laser cutting can be provided.

Semiconductor silicon wafer thinning processing

The thinning of the silicon wafer can be reduced to the thinnest thickness below 20 μm, with an accuracy of 3 to 5 μm.

The 8 inch thinnest mass production specification is 85μm.
The lithium niobate lithium tantalate substrate can be thinned to 10μm.