Silicon dicing wafer
Fuleda Technology supplies semiconductor polishing wafers and oxide cutting product using different dicing methods, including blades and laser cutting.
Various silicon wafers can be made to meet requirements of the order, such as 10×10mm, 30×30mm, 50×50mm, etc.
| Growth | CZ、FZ |
| Grade | Prime,Test,Dummy,etc. |
| Dicing Size | 3×3mm,5×5mm,10×10mm,10×20mm,50×50mm etc. |
| Thickness | 50～1000um |
| Surface Finish | Polish,Oxide film etc. |
| Orientation | (100)(111)(110)(211),etc. |
| Type/Dopant | P-type/B,N-type/Phos,N-type/As,N-type/Sb,intrinsic |
| Resistivity | CZ/MCZ:From 0.001 to 1000 ohm-cm |
| Thin films | PVD:Al,Cu,Cr,Si,Ni,Fe,Mo.etc, PECBD:Oxide,Nitride,SiC,etc |
| Processes | Blade or laser dicing |
